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MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
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Dual Schottky Barrier Diode
These devices are designed primarily for UHF mixer applications but are suitable also for use in detector and ultra-fast switching circuits. * Very Low Capacitance -- Less Than 1.0 pF @ Zero Volts * Low Forward Voltage -- 0.5 Volts (Typ) @ IF = 10 mA
MMBD352WT1
3 1 2
1 ANODE
MAXIMUM RATINGS
Rating Continuous Reverse Voltage Symbol VR Value 7.0 Unit VCC
3 CATHODE/ANODE
2 CATHODE
THERMAL CHARACTERISTICS
Characteristic Total Device Dissipation FR- 5 Board(1) TA = 25C Derate above 25C Thermal Resistance, Junction to Ambient Total Device Dissipation Alumina Substrate(2) TA = 25C Derate above 25C Thermal Resistance, Junction to Ambient Junction and Storage Temperature Symbol PD Max 200 1.6 RqJA PD 625 300 2.4 RqJA TJ, Tstg 417 - 55 to +150 Unit mW mW/C C/W mW mW/C C/W C
MMBD352WT1 CASE 419 - 02, STYLE 9 SOT- 323 (SC - 70)
DEVICE MARKING
MMBD352WT1 = M5
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic Symbol Min Max Unit
OFF CHARACTERISTICS
Forward Voltage (IF = 10 mAdc) Reverse Voltage Leakage Current (VR = 3.0 V) (VR = 7.0 V) Capacitance (VR = 0 V, f = 1.0 MHz) 1. FR- 5 = 1.0 0.75 2. Alumina = 0.4 0.3 VF IR -- -- C -- 0.25 10 1.0 pF -- 0.60 V
mA
0.062 in. 0.024 in. 99.5% alumina.
Thermal Clad is a trademark of the Bergquist Company
Motorola Small-Signal Transistors, FETs and Diodes Device Data (c) Motorola, Inc. 1997
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MMBD352WT1
TYPICAL CHARACTERISTICS
100 I F, FORWARD CURRENT (mA) 1.0
10 TA = -40C
C, CAPACITANCE (pF) 0.8
TA = 85C
0.9
0.8
1.0 TA = 25C
0.7
0.1 0.3 0.4 0.5 0.6 0.7 VF, FORWARD VOLTAGE (VOLTS)
0.6 0 1.0 2.0 3.0 4.0 VR, REVERSE VOLTAGE (VOLTS)
Figure 1. Forward Voltage
Figure 2. Capacitance
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Motorola Small-Signal Transistors, FETs and Diodes Device Data
MMBD352WT1
INFORMATION FOR USING THE SOT-323 SURFACE MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection
0.025 0.65
interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process.
0.025 0.65
0.075 1.9 0.035 0.9 0.028 0.7 inches mm
SC-70/SOT-323 POWER DISSIPATION
The power dissipation of the SC-70/SOT-323 is a function of the collector pad size. This can vary from the minimum pad size for soldering to the pad size given for maximum power dissipation. Power dissipation for a surface mount device is determined by TJ(max), the maximum rated junction temperature of the die, RJA, the thermal resistance from the device junction to ambient; and the operating temperature, TA. Using the values provided on the data sheet, PD can be calculated as follows. PD = TJ(max) - TA RJA the equation for an ambient temperature TA of 25C, one can calculate the power dissipation of the device which in this case is 200 milliwatts. PD = 150C - 25C 0.625C/W = 200 milliwatts
The values for the equation are found in the maximum ratings table on the data sheet. Substituting these values into
The 0.625C/W assumes the use of the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation of 200 milliwatts. Another alternative would be to use a ceramic substrate or an aluminum core board such as Thermal CladTM. Using a board material such as Thermal Clad, a power dissipation of 300 milliwatts can be achieved using the same footprint.
SOLDERING PRECAUTIONS
The melting temperature of solder is higher than the rated temperature of the device. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. Therefore, the following items should always be observed in order to minimize the thermal stress to which the devices are subjected. * Always preheat the device. * The delta temperature between the preheat and soldering should be 100C or less.* * When preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When using infrared heating with the reflow soldering method, the difference should be a maximum of 10C.
* The soldering temperature and time should not exceed * When shifting from preheating to soldering, the * After soldering has been completed, the device should
be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress. * Mechanical stress or shock should not be applied during cooling * Soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device. maximum temperature gradient should be 5C or less. 260C for more than 10 seconds.
Motorola Small-Signal Transistors, FETs and Diodes Device Data
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MMBD352WT1
PACKAGE DIMENSIONS
A L
3
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. INCHES MIN MAX 0.071 0.087 0.045 0.053 0.035 0.049 0.012 0.016 0.047 0.055 0.000 0.004 0.004 0.010 0.017 REF 0.026 BSC 0.028 REF 0.031 0.039 0.079 0.087 0.012 0.016 MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.90 1.25 0.30 0.40 1.20 1.40 0.00 0.10 0.10 0.25 0.425 REF 0.650 BSC 0.700 REF 0.80 1.00 2.00 2.20 0.30 0.40
S
1 2
B
V G
D
C 0.05 (0.002)
RN K
J
DIM A B C D G H J K L N R S V
H
STYLE 9: PIN 1. ANODE 2. CATHODE 3. CATHODE-ANODE
CASE 419-02 ISSUE H SOT-323 (SC-70)
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MMBD352WT1/D Motorola Small-Signal Transistors, FETs and Diodes Device Data

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